We present a room-temperature bonding technique which enables the sealing of micromolded water-swollen poly-2-hydroxy ethyl methacrylate (PHEMA)-based hydrogel modules to thermoplastic and elastomeric platforms. The core mechanism of the proposed method is to favor the formation of hydrogen bonds at the interface between the surface-reactive hydrated hydrogel components and the functionalized hydrophobic materials, by contacting the polymeric layers via a mild compression. Plasma oxygen and silanization processes using 3-amino-propyl trimethoxy silane have been optimized to generate surface hydroxyl functionalities on poly-methyl methacrylate (PMMA) and poly-dimethyl siloxane (PDMS) platforms which can react with the OH groups’ enriched surface of the microstructured PHEMA. The resulting microsystems can operate in a continuous perfusion mode while being soaked in water to keep the hydrogel hydrated. The method could also be applied to bond PHEMA thin layers (300 μm thick) to PMMA and PDMS microfluidic components. The sealing properties of the produced devices were demonstrated by liquid leakage tests and further validated by hydration–dehydration cycles of the systems and by monitoring methylene blue diffusion through the hydrogel matrix at the modules interface. The presented technique is suitable for cells-based hybrid materials microfluidic devices rapid prototyping.

A room-temperature bonding technique for the packaging of hydrogel-based hybrid microfluidic devices / T. Santaniello, Y. Yan, A. Tocchio, F. Martello, P. Milani, C. Lenardi. - In: MICROFLUIDICS AND NANOFLUIDICS. - ISSN 1613-4982. - 19:1(2015), pp. 31-41. [10.1007/s10404-015-1544-x]

A room-temperature bonding technique for the packaging of hydrogel-based hybrid microfluidic devices

T. Santaniello
;
Y. Yan
Secondo
;
A. Tocchio;F. Martello;P. Milani
Penultimo
;
C. Lenardi
Ultimo
2015

Abstract

We present a room-temperature bonding technique which enables the sealing of micromolded water-swollen poly-2-hydroxy ethyl methacrylate (PHEMA)-based hydrogel modules to thermoplastic and elastomeric platforms. The core mechanism of the proposed method is to favor the formation of hydrogen bonds at the interface between the surface-reactive hydrated hydrogel components and the functionalized hydrophobic materials, by contacting the polymeric layers via a mild compression. Plasma oxygen and silanization processes using 3-amino-propyl trimethoxy silane have been optimized to generate surface hydroxyl functionalities on poly-methyl methacrylate (PMMA) and poly-dimethyl siloxane (PDMS) platforms which can react with the OH groups’ enriched surface of the microstructured PHEMA. The resulting microsystems can operate in a continuous perfusion mode while being soaked in water to keep the hydrogel hydrated. The method could also be applied to bond PHEMA thin layers (300 μm thick) to PMMA and PDMS microfluidic components. The sealing properties of the produced devices were demonstrated by liquid leakage tests and further validated by hydration–dehydration cycles of the systems and by monitoring methylene blue diffusion through the hydrogel matrix at the modules interface. The presented technique is suitable for cells-based hybrid materials microfluidic devices rapid prototyping.
No
English
Cells on chip; Hydrogels; Micromolding; Packaging; Surface functionalization; Condensed Matter Physics; Electronic, Optical and Magnetic Materials; Materials Chemistry2506 Metals and Alloys
Settore FIS/01 - Fisica Sperimentale
Settore FIS/03 - Fisica della Materia
Articolo
Esperti anonimi
Ricerca di base
Pubblicazione scientifica
2015
Springer
19
1
31
41
11
Pubblicato
Periodico con rilevanza internazionale
scopus
crossref
NON aderisco
info:eu-repo/semantics/article
A room-temperature bonding technique for the packaging of hydrogel-based hybrid microfluidic devices / T. Santaniello, Y. Yan, A. Tocchio, F. Martello, P. Milani, C. Lenardi. - In: MICROFLUIDICS AND NANOFLUIDICS. - ISSN 1613-4982. - 19:1(2015), pp. 31-41. [10.1007/s10404-015-1544-x]
none
Prodotti della ricerca::01 - Articolo su periodico
6
262
Article (author)
no
T. Santaniello, Y. Yan, A. Tocchio, F. Martello, P. Milani, C. Lenardi
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/2434/352758
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