The ATLAS collaboration is currently building 1500 pixel modules using the indium bump bonding technique developed by SELEX Sistemi Integrati (former AMS). The indium deposition and flip-chip process are described together with an overview of the chip stripping machine that allows defective modules to be reworked. The prodn. is half-way through at the time of this writing. This paper also discusses the problems encountered during prodn. and the adopted solns.
Analysis of the production of ATLAS indium bonded pixel modules / G. Alimonti, A. Andreazza, A. Bulgheroni, G. Corda, S. Di Gioia, A. Fiorello, C. Gemme, M. Koziel, F. Manca, C. Meroni, P. Nechaeva, A. Paoloni, L. Rossi, A. Rovani, E. Ruscino. - In: NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH. SECTION A, ACCELERATORS, SPECTROMETERS, DETECTORS AND ASSOCIATED EQUIPMENT. - ISSN 0168-9002. - 565:1(2006 Sep 01), pp. 296-302. [10.1016/j.nima.2006.05.048]
Analysis of the production of ATLAS indium bonded pixel modules
A. Andreazza;C. Meroni;
2006
Abstract
The ATLAS collaboration is currently building 1500 pixel modules using the indium bump bonding technique developed by SELEX Sistemi Integrati (former AMS). The indium deposition and flip-chip process are described together with an overview of the chip stripping machine that allows defective modules to be reworked. The prodn. is half-way through at the time of this writing. This paper also discusses the problems encountered during prodn. and the adopted solns.
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