About half of the ATLAS pixel modules have been assembled with the Selex indium bump bonding process. The requirements of the ATLAS Insertable B-Layer (IBL) detector ask for larger and thinner chips, two critical parameters for bonding processes. We report on the research and development carried on with Selex to produce modules with 100 μm thick and 18.8 × 20.2 mm2 area read out chips bonded with indium bumps.
Development of Indium bump bonding for the ATLAS Insertable B-layer (IBL) / G. Alimonti, A. Andreazza, G. Corda, G. Darbo, S. D. Gioia, A. Fiorello, G. Gariano, C. Gemme, C. Meroni, A. Rovani, E. Ruscino. - In: JOURNAL OF INSTRUMENTATION. - ISSN 1748-0221. - 8:1(2013 Jan), pp. P01024.1-P01024.10.
Development of Indium bump bonding for the ATLAS Insertable B-layer (IBL)
A. AndreazzaSecondo
;C. Meroni;
2013
Abstract
About half of the ATLAS pixel modules have been assembled with the Selex indium bump bonding process. The requirements of the ATLAS Insertable B-Layer (IBL) detector ask for larger and thinner chips, two critical parameters for bonding processes. We report on the research and development carried on with Selex to produce modules with 100 μm thick and 18.8 × 20.2 mm2 area read out chips bonded with indium bumps.
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