ASIX: Single-photon, energy resolved X-ray imaging with 50 μm hexagonal hybrid pixel

The Analog Spectral Imager for X-rays is a technology demonstrator of a small-pixel Hybrid Pixel Detector (HPD) designed for applications such as X-ray diffraction, synchrotron-based material science, and soft X-ray astrophysics requiring energy-resolved imaging. The ASIX architecture aims at mitigating the adverse effects of charge sharing, typical of small-pixel devices. In contrast to other frame-based photon counters or multi-threshold devices, ASIX employs, along with a (Formula presented.) pixel, an ultra-low-noise ((Formula presented.) 30 (Formula presented.) ENC), fully analog, asynchronous, single-photon readout, targeting (Formula presented.) spatial resolution and 350 eV FWHM at 8 keV within the same exposure. In 2025, we began developing a small scale ((Formula presented.)) HPD coupling a (Formula presented.) -thick, n-on-p, edgeless silicon sensor with (Formula presented.) pixels arranged in a hexagonal pattern to a newly designed 65-nm CMOS readout ASIC, featuring single-photon readout and on-chip analog to digital conversion, with a target rate capability of (Formula presented.). While the baseline for the ASIX R&D sensor is silicon for (Formula presented.) 20 keV operation, the design of the readout ASIC is compatible with High-Z materials sensors, such as cadmium-telluride or gallium-arsenide, for higher energies X-rays imaging, enabling potential extension to biomedical and preclinical research. This paper describes the ASIX imager architecture and reports on the development and testing of two Minimum Viable Products (MVPs), developed by coupling XPOL-III, a readily available 180-nm CMOS readout ASIC, to a (Formula presented.) thick silicon sensor with (Formula presented.) pixels and to a (Formula presented.) thick CdTe sensor with (Formula presented.) pixels, respectively. The MVPs achieved estimated energy resolution of (Formula presented.) FWHM at 17.5 keV (CdTe), and (Formula presented.) FWHM at (Formula presented.) (silicon) and spatial resolution of (Formula presented.) (CdTe) and (Formula presented.) (silicon). These results confirm our preliminary models predicting the feasibility of simultaneous high energy and spatial resolution in such a small-pixel devices, thus securing the ASIX specifications. Finally, the paper highlights the technology gaps that ASIX would potentially fill in both terrestrial and space applications.