A dedicated test chip has been designed in order to support the study of the EMC performance, and more specifically the Conducted Emission, of a microcontroller family in M28 FDSOI technology. The focus in designing the test chip has been put on the on-die decoupling capacitors, in particular on the topology of the placement as well as the capacitance amount.
Effects of the On-Die Decoupling Capacitors on the EME Performance in 28 nm FD-SOI Technology / M. Rotigni, M. Merlo, A. Sanna, P. Colombo, R. Castellan, V. Liberali, A. Barletta, R. Dechecchi, K.S. Skytte - In: 2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)[s.l] : IEEE, 2019. - ISBN 978-1-7281-4263-0. - pp. 78-80 (( Intervento presentato al 12. convegno EMC tenutosi a Hangzhou nel 2019 [10.1109/EMCCompo.2019.8919707].
Effects of the On-Die Decoupling Capacitors on the EME Performance in 28 nm FD-SOI Technology
V. Liberali;
2019
Abstract
A dedicated test chip has been designed in order to support the study of the EMC performance, and more specifically the Conducted Emission, of a microcontroller family in M28 FDSOI technology. The focus in designing the test chip has been put on the on-die decoupling capacitors, in particular on the topology of the placement as well as the capacitance amount.
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