Effect of different bur grinding on the bond strength of self–etching adhesives

This study compared the microtensile bond strength (MTBS) of three all-in-one adhesive systems and a two-step system using two types of burs to prepare the dentin surfaces. Flat coronal surfaces of 24 extracted human molars were produced using either regular-grit or superfine-grit diamond burs. Resin composite was then bonded to equal numbers of these surfaces using one of the four adhesives: Clearfil SE Bond (CSE), G-Bond (GB), SSB-200 (SSB) or Prompt L-Pop (PLP). After storage for 24 hours in 37 C distilled water, the bonded teeth were sectioned into slices (0.7-mm thick) perpendicular to the bonded surface. The specimens were then subjected to microtensile testing and the bond strengths were calculated at failure. Bond strength data were analyzed by two-way ANOVA and the Games-Howell test for interaction between adhesive and type of cut dentin. The fractured surfaces were observed by SEM to determine the failure mode. In addition, to observe the effect of conditioning, equal numbers of the two bur-cut dentin surfaces of eight additional teeth were conditioned with the adhesives and observed by SEM. Based on the results, when CSE and SSB were bonded to dentin cut with a regular-grit diamond bur, the MTBS values were significantly lower than that of superfine bur-cut dentin; whereas, GB and PLP showed no significant differences in MTBS between the two differently cut surfaces. SEM observation of the fractured surfaces revealed a mixed mode (adhesive in some areas and cohesive in others in the same sample) of failure in all specimens except PLP, which showed cohesive failure within the adhesive for both types of bur preparation. Generally, SEMs of the conditioned surfaces using both types of burs showed partial removal of the smear layer for CSE, minimal for GB and SSB and complete removal for PLP. In conclusion, when cutting dentin, selecting the proper bur type is important for improving the bond strength of some self-etching adhesive systems.