We report on further developments of our proposed design approach for a full in-pixel signal processing chain of deep N-well monolithic active pixel sensor, by exploiting the triple well option of a CMOS 130 nm process. Two different geometries of the collecting electrode (namely "Apsel 3T1 M1" and "Apsel 3T1 M2") was implemented to compare their charge collection efficiency. The results of the characterization of the various versions of pixel matrices with a pion beam of 120 GeV/c at the SPS H6 CERN facility will be presented. The performances of an "Apsel 3T1" chip irradiated with a dose up to 10 Mrad (Co60) was also measured. Comparison will be presented among the irradiated and the new chip showing the impact of radiation damages on tracking efficiencies.

Beam test results of different configurations of deep N-well MAPS matrices featuring in pixel full signal processing / E. Paoloni, C. Avanzini, G. Batignani, S. Bettarini, F. Bosi, G. Calderini, G. Casarosa, M. Ceccanti, R. Cenci, A. Cervelli, F. Crescioli, M. Dell'Orso, F. Forti, P. Giannetti, M.A. Giorgi, A. Lusiani, S. Gregucci, P. Mammini, G. Marchiori, M. Massa, F. Morsani, N. Neri, M. Piendibene, A. Profeti, G. Rizzo, L. Sartori, J. Walsh, E. Yurtsev, M. Manghisoni, V. Re, G. Traversi, M. Bruschi, R. Di Sipio, B. Giacobbe, A. Gabrielli, F. Giorgi, G. Pellegrini, C. Sbarra, N. Semprini, R. Spighi, S. Valentinetti, M. Villa, A. Zoccoli, M. Citterio, V. Liberali, F. Palombo, C. Andreoli, L. Gaioni, E. Pozzati, L. Ratti, V. Speziali, D. Gamba, G. Giraudo, P. Mereu, G.F. Dalla Betta, G. Soncini, G. Fontana, M. Bomben, L. Bosisio, P. Cristaudo, G. Giacomini, D. Jugovaz, L. Lanceri, I. Rashevskaya, L. Vitale, G. Venier. - In: NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH. SECTION A, ACCELERATORS, SPECTROMETERS, DETECTORS AND ASSOCIATED EQUIPMENT. - ISSN 0168-9002. - 628:1(2011 Feb), pp. 234-237. [10.1016/j.nima.2010.06.325]

Beam test results of different configurations of deep N-well MAPS matrices featuring in pixel full signal processing

N. Neri;V. Liberali;F. Palombo;
2011

Abstract

We report on further developments of our proposed design approach for a full in-pixel signal processing chain of deep N-well monolithic active pixel sensor, by exploiting the triple well option of a CMOS 130 nm process. Two different geometries of the collecting electrode (namely "Apsel 3T1 M1" and "Apsel 3T1 M2") was implemented to compare their charge collection efficiency. The results of the characterization of the various versions of pixel matrices with a pion beam of 120 GeV/c at the SPS H6 CERN facility will be presented. The performances of an "Apsel 3T1" chip irradiated with a dose up to 10 Mrad (Co60) was also measured. Comparison will be presented among the irradiated and the new chip showing the impact of radiation damages on tracking efficiencies.
Monolithic active pixels sensors; Vertex detectors
Settore FIS/01 - Fisica Sperimentale
Settore ING-INF/01 - Elettronica
feb-2011
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/2434/150608
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